Gomez, Frederick Ray I., STMicroelectronics, Inc., Philippines

• Asian Journal of Engineering and Technology Vol. 6 No. 6 (2018): December 2018 - Articles
  Package Design Optimization with Reliability Test Verification for Reduction of Voids and Delamination
  Abstract  PDF
• Asian Journal of Engineering and Technology Vol. 6 No. 6 (2018): December 2018 - Articles
  A Methodical Approach in Critical Processes Optimization of New Scalable Package Semiconductor Device for ESD Applications
  Abstract  PDF